What method is suggested for the removal of thermal compound?

The suggested method for the removal of thermal compound involves the use of isopropyl alcohol wipes or a cotton swab dipped in isopropyl alcohol. This approach is effective because isopropyl alcohol is a solvent that can dissolve and remove greasy residues, such as thermal compound, without leaving behind moisture or residue that could interfere with the performance of the thermal interface material once it’s reapplied.

Using isopropyl alcohol ensures that all remnants of the old thermal compound are effectively cleaned off the surfaces, including CPU and heatsink contact points, preparing them for the application of new thermal compound. Additionally, isopropyl alcohol evaporates quickly, minimizing the risk of damage to electronic components due to moisture.

In contrast, other methods could introduce issues; for example, using soap and water might leave moisture on the components, which is not advisable. Vinegar wipes could potentially cause corrosion or damage, while a dry cloth may not adequately remove the sticky and viscous thermal compound. Thus, the use of isopropyl alcohol provides a thorough and safe cleaning solution for thermal compounds in electronic environments.