What is a correct procedure for replacing thermal compound on a laptop?

Applying thermal compound correctly is crucial for ensuring optimal heat transfer between the CPU/GPU and the heat sink, which can help prevent overheating and maintain performance. Spreading the thermal compound until the entire surface is covered is the best approach because it ensures that there is an even, thin layer across the entire contact area. This uniform application allows for maximum contact with the surfaces involved, resulting in better thermal conductivity.

Using a thin layer is essential, as excess thermal compound can actually impede cooling rather than enhance it. A properly spread layer fills in microscopic imperfections without spilling over the edges. This method helps to avoid potential short circuits or other issues that can arise from excess compound that might seep into other components of the laptop.

The other choices do not provide a proper guideline for thermal compound application. Leaving some areas uncovered can lead to hotspots, where parts of the chip do not receive adequate cooling. Applying thermal compound only on specific hotspots does not ensure comprehensive coverage, which is necessary for efficient heat dissipation. Using a thick layer can also backfire, causing more problems than it solves, as it may not spread evenly and can create air pockets, which can inhibit effective heat transfer.